Etched leadframe flipchip package system

ABSTRACT

The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having solder interconnects on the contact leads between each of the plurality of the multiple dotted grooves.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of U.S. Provisional PatentApplication Ser. No. 60/595,830 filed Aug. 9, 2005, and the subjectmatter thereof is hereby incorporated herein by reference thereto.

TECHNICAL FIELD

The present invention relates generally to integrated circuit packagesystems, and more particularly to a system for manufacturing a flip-chipintegrated circuit package system.

BACKGROUND ART

As the electronics industry progresses integrated circuit (IC) productsare shrinking in size. The applications supported by these IC's arebecoming more powerful with ever increasing features and functions. Thisis exemplified as the telephone was transformed into the cellular phoneand most recently into the camera phone. All the while these devicescontinue to shrink in size. Other devices that have evolved includecomputers, memory devices, personal music players and personal dataassistants (PDA's). Each is operated by an integrated circuit die.

An IC die is a small device formed on a semiconductor wafer, such as asilicon wafer. A leadframe is a metal frame that usually includes apaddle that supports an IC die that has been cut from the wafer. Theleadframe has lead fingers that provide external electrical connections.That is, the die is attached to the die paddle and then bonding pads ofthe die are connected to the lead fingers via wire bonding or flip chipbumping to provide the external electrical connections. Encapsulatingthe die and wire bonds or flip chip bump with a protective materialforms a package. Depending on the package type, the external electricalconnections may be used as-is, such as in a Thin Small Outline Package(TSOP), or further processed, such as by attaching spherical solderballs for a Ball Grid Array (BGA). These terminal points allow the dieto be electrically connected with other circuits, such as on a printedcircuit board.

Use of packaged ICs is widespread. Moreover, the size and cost ofelectronic devices puts continuous pressure on the need for small, yetless costly packaged ICs. Furthermore, for high bandwidth RF devices andhigh operating frequency devices, there is a push for shorter electricalpaths inside the IC package. Flip chip bonding can replace thetraditional wire bonding interconnection.

There are also manufacturing issues that plague the flipchip assemblyprocess. With the attachment of the flipchip solder balls to theleadframe or substrate, the IC die has a tendency to move during thereflow connection. As the solder becomes viscous, the die can be movedby the surface tension in the liquid solder. Due to the small size ofthe IC die, it is difficult to hold the IC die in a fixed position. Anymovement during the attachment process can cause a package failure andreduced yield.

A key component in the die attach process is the leadframe preparation.As the solder liquefies, during reflow, it will flow to any surface thatwill bond with it. Preparing a leadframe for flipchip attachment can bea meticulous and costly process. Thus, it is desirable to provide aninexpensive method of flip chip interconnection packaging ICs. It alsois desirable to have a method of decreasing the size of such packagedICs.

Thus, a need still remains for a reliable high volume capable processfor flipchip assembly on leadframe packages. In view of the demand forhigh volume low profile packages, it is increasingly critical thatanswers be found to these problems. The ever increasing need to savecosts and improve efficiencies, makes it is more and more critical thatanswers be found to these problems. Solutions to these problems havebeen long sought but prior developments have not taught or suggested anysolutions and, thus, solutions to these problems have long eluded thoseskilled in the art.

DISCLOSURE OF THE INVENTION

The present invention provides an etched leadframe flipchip packagesystem comprising forming a leadframe comprises forming a die paddle,forming contact leads around the die paddle, forming tie bars to the diepaddle and etching a plurality of multiple dotted grooves on the contactleads, and attaching a flipchip integrated circuit, having solderinterconnects, to the leadframe, wherein the solder interconnects on thecontact leads between the each of the plurality of the multiple dottedgrooves.

Certain embodiments of the invention have other aspects in addition toor in place of those mentioned or obvious from the above. The aspectswill become apparent to those skilled in the art from a reading of thefollowing detailed description when taken with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of an etched leadframe flipchip package system, inan embodiment of the present invention;

FIG. 2 is a cross-sectional view of an integrated circuit package,including the etched leadframe of FIG. 1;

FIG. 3 is a plan view of an etched leadframe in an alternativeembodiment of the present invention;

FIG. 4 is a cross-sectional view of an integrated circuit packagesystem, including the etched leadframe flipchip package system of FIG.3;

FIG. 5 is a plan view of an etched leadframe flipchip package system, inanother alternative embodiment of the present invention;

FIG. 6 is a cross-sectional view of an integrated circuit package systemincluding the etched leadframe flipchip package system of FIG. 5;

FIG. 7 is a cross-sectional view of an integrated circuit packagesystem, including the etched leadframe flipchip package system of FIG.5;

FIG. 8 is a more detailed plan view of the contact leads with thepassive component attached, on fine pitch;

FIG. 9 is a more detailed plan view of the contact leads with thepassive component attached, on wide pitch;

FIG. 10 is a plan view of an etched leadframe flipchip package system inanother alternative embodiment of the present invention;

FIG. 11 is a cross-sectional view of the etched leadframe flipchippackage system along the line 11-11 of FIG. 10;

FIG. 12 is a cross-sectional view of an integrated circuit packagesystem, including the etched leadframe flipchip package system of FIG.10;

FIG. 13 is a plan view of an etched leadframe flipchip package system inyet another alternative embodiment of the present invention;

FIG. 14 is a cross-sectional view of the etched leadframe flipchippackage system along the line 14-14 of FIG. 13;

FIG. 15 is a plan view of an etched leadframe flipchip package system inyet another alternative embodiment of the present invention;

FIG. 16 is a cross-sectional view of the etched leadframe flipchippackage system along the line 16-16 of FIG. 15; and

FIG. 17 is a flow chart of an etched leadframe package system formanufacturing of the etched leadframe flipchip package system in anembodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

In the following description, numerous specific details are given toprovide a thorough understanding of the invention. However, it will beapparent that the invention may be practiced without these specificdetails. In order to avoid obscuring the present invention, somewell-known circuits, system configurations, and process steps are notdisclosed in detail. Likewise, the drawings showing embodiments of theapparatus are semi-diagrammatic and not to scale and, particularly, someof the dimensions are for the clarity of presentation and are showngreatly exaggerated in the drawing FIGs. Also, where multipleembodiments are disclosed and described having some features in commonfor clarity and ease of illustration, description, and comprehensionthereof, similar and like features one to another will ordinarily bedescribed with like reference numerals.

The term “horizontal” as used herein is defined as a plane parallel tothe conventional plane or surface of the integrated circuit die,regardless of its orientation. The term “vertical” refers to a directionperpendicular to the horizontal as just defined. Terms, such as “above”,“below”, “bottom”, “top”, “side” (as in “sidewall”), “higher”, “lower”,“upper”, “over”, and “under”, are defined with respect to the horizontalplane. The term “on” means there is direct contact among elements. Theterm “processing” as used herein includes deposition of material orphotoresist, patterning, exposure, development, etching, cleaning,and/or removal of the material or photoresist as required in forming adescribed structure.

Referring now to FIG. 1, therein is shown a plan view of an etchedleadframe flipchip package system 100, in an embodiment of the presentinvention. The etched leadframe flipchip package system 100 includescontact leads 102, having multiple dotted grooves 104, a die paddle 106,with tie bars 108 attached at the corners of the die paddle 106. Thecontact leads 102 have the multiple dotted grooves 104, a solder ballcontact 110 and an external contact lead 112. Also displayed arealternate contact leads 114 having the multiple dotted grooves 104, arectangular solder contact 116 and the external contact lead 112. It isunderstood that the etched leadframe flipchip package system 100 maycontain any combination of the contact leads 102 and the alternatecontact leads 114. The tie bars 108, the contact leads 102 and thealternate contact leads 114 are attached to a leadframe support strip118 during assembly. The leadframe support strip 118 is removed in asingulation process.

The tie bars 108, the contact leads 102 and the alternate contact leads114 may be formed in any number of processes, such as half etching. Thehalf etch process removes some of the material, such as a dual gaugecopper alloy, from the bottom of the tie bars 108, the contact leads 102and the alternate contact leads 114. The multiple dotted grooves 104 area series of etched dots of a controlled depth in the contact leads 102in the range between 25 μm and 60 μm deep. The etched dots forming themultiple dotted grooves 104 may slightly overlap or may be spaced amaximum of 25 μm apart.

Referring now to FIG. 2, therein is shown a cross-sectional view of anintegrated circuit package system 200 utilizing the etched leadframeflipchip package system 100 of FIG. 1. The cross-sectional view of theintegrated circuit package system 200 depicts an integrated circuit 202,such as an active circuit or an integrated power device (IPD), havingsolder interconnects 204 attached to the solder ball contact 110. Thesolder interconnects 204 are shown as solder balls, but it is understoodthat they may be stud bumps or solder column interposers.

The multiple dotted grooves 104 form a solder isolation barrier for thereflow process. The surface tension of the solder interconnects 204maintains the substantially ball shape and height during attachment ofthe integrated circuit 202 to the solder ball contact 110. An etchedsurface 206 is the result of the half etch process that facilitates flowof a molding compound 208 during the package molding phase ofmanufacturing. The half etch process substantially reduces the thicknessof the contact leads 102 and the die paddle 106 to approximately half ofthe initial thickness of the contact leads 102.

The contact leads 102 may become partially encased in the moldingcompound 208. The external contact lead 112 protrudes from the moldingcompound 208 and forms a package connection surface 210. The integratedcircuit package system 200 is shown as a flipchip quad leadless package(FC-QLP) utilizing the etched leadframe flipchip package system 100. Thepackage connection surface 210 is used to attach the integrated circuitpackage system 200 to the next higher assembly (not shown), such as aprinted circuit board.

Referring now to FIG. 3, therein is shown a plan view of an etchedleadframe flipchip package system 300, in an alternative embodiment ofthe present invention. The etched leadframe flipchip package system 300includes an alternative die paddle 302 having a solder containmentsurface 304. The solder containment surface 304 is bordered by aplurality of the multiple dotted grooves 104 arranged in a geometricshape, such as a circle. Each of the plurality of the multiple dottedgrooves 104 is spaced no greater than 25 μm from each other. Thisspacing is used to prevent seepage of the solder during the reflowprocess.

The contact leads 102 are arranged around the alternative die paddle302, which has the tie bars 108 attached at the corners. The tie bars108 connect the alternative die paddle 302 to the leadframe supportstrip 118. The leadframe support strip 118 also supports the contactleads 102.

Referring now to FIG. 4, therein is shown a cross-sectional view of anintegrated circuit package system 400, including the etched leadframeflipchip package system 300 of FIG. 3. The cross-sectional view of theintegrated circuit package system 400 depicts an integrated circuit 402attached, to the alternative die paddle 302 and the contact leads 102,in a flipchip configuration, by interconnects 404, such as solder balls,stud bumps or solder column interposers. Each of the interconnects 404is bordered by the plurality of the multiple dotted grooves 104. In thesolder reflow phase of manufacturing, the multiple dotted grooves 104act as a solder barrier to keep the molten solder in a substantiallyball configuration, by constraining it within the limits of the multipledotted grooves 104. The surface tension of the solder holds thesubstantially rounded configuration that prevents the interconnects 404from collapsing. The result is a uniform and reliable connection betweenthe integrated circuit 402, the alternative die paddle 302 and thecontact leads 102.

The molding compound 208 encapsulates the integrated circuit 402, theinterconnects 404, the alternative die paddle 302 and the contact leads102. The alternative die paddle 302 and the contact leads 102 arepartially half etched. This allows smooth flow of the molding compound208 during the encapsulation phase of manufacturing. The alternative diepaddle 302 may be implemented as a heat sink for the integrated circuit402, when it is attached to a printed circuit board (not shown).

Referring now to FIG. 5, therein is shown a plan view of an etchedleadframe flipchip package system 500, in another alternative embodimentof the present invention. The etched leadframe flipchip package system500 includes a three element contact lead 502, the alternative diepaddle 302 having the solder containment surface 304. The soldercontainment surface 304 is bordered by the plurality of the multipledotted grooves 104 arranged in a geometric shape, such as a circle. Eachof the plurality of the multiple dotted grooves 104 is spaced no greaterthan 25 μm from each other. This spacing is used to prevent seepage ofthe solder during the reflow process.

The three element contact lead 502 has three sets of the multiple dottedgrooves 104 for attachment of circuit components (not shown). The threesets are a first groove row 504, a second groove row 506, and a thirdgroove row 508 allowing for additional contact sites or alternativecontact sites for different sized integrated circuits (not shown).

Referring now to FIG. 6, therein is shown a cross-sectional view of anintegrated circuit package system 600 including the etched leadframeflipchip package system 500 of FIG. 5. The cross-sectional view of theintegrated circuit package system 600 depicts an integrated circuit 602,such as an active circuit or an integrated power device (IPD), havingthe solder interconnects 204 attached to the alternative die paddle 302and the three element contact lead 502. The solder interconnects 204 areshown as solder balls, but it is understood that they may be stud bumpsor solder column interposers.

The three element contact lead 502 supports three of the solderinterconnects 204 separated by the plurality of the multiple dottedgrooves 104. The plurality of the multiple dotted grooves 104 forms asolder barrier and constrains the shape of the solder interconnects 204due to the surface tension of the solder in the molten state.

The molding compound 208 encapsulates the integrated circuit 602, thesolder interconnects 204, the alternative die paddle 302 and the threeelement contact lead 502. The alternative die paddle 302 and the threeelement contact lead 502 are partially half etched. This allows flow ofthe molding compound 208 during the encapsulation phase ofmanufacturing.

Referring now to FIG. 7, therein is shown a cross-sectional view of anintegrated circuit package system 700, including the etched leadframeflipchip package system 500 of FIG. 5. The cross-sectional view of theintegrated circuit package system 700 depicts a flipchip integratedcircuit 702, such as an active circuit or an integrated power device(IPD), having the solder interconnects 204 attached to the alternativedie paddle 302 and the three element contact lead 502. The solderinterconnects 204 are shown as solder balls, but it is understood thatthey may be stud bumps or solder column interposers.

The three element contact lead 502 supports one of the solderinterconnects 204 separated by the plurality of the multiple dottedgrooves 104 and a passive component 704, such as an inductor, acapacitor or a resistor. The multiple dotted grooves 104 form a solderbarrier and constrains the shape of the solder interconnects 204 due tothe surface tension of the solder in the molten state.

The molding compound 208 encapsulates the flipchip integrated circuit702, the solder interconnects 204, the alternative die paddle 302, andthe three element contact lead 502. The alternative die paddle 302 andthe three element contact lead 502 are partially half etched. Thisallows flow of the molding compound 208 during the encapsulation phaseof manufacturing.

Referring now to FIG. 8, therein is shown a more detailed plan view ofthe contact leads 102 with the passive component 704 attached, on finepitch. The plan view depicts the passive component 704 attached betweenan adjacent pair of the contact leads 102, on fine pitch. The fine pitchspacing is such that the passive component 704 will reach across thespace between the contact leads 102. The passive component 704 ispositioned between the plurality of the multiple dotted grooves 104arranged across the width of the contact leads 102. The plurality of themultiple dotted grooves 104 forms a component pad 802 on the contactleads 102.

Referring now to FIG. 9, therein is shown a more detailed plan view ofthe contact leads 102 with the passive component 704 attached, on widepitch. The more detailed plan view depicts the passive component 704attached between an adjacent pair of the contact leads 102, on widepitch. The wide pitch spacing is such that the passive component 704will not reach across the space between the contact leads 102. In thiscase, a lead tab 902 is designed into each of the contact leads 102supporting the passive component 704. The lead tab 902 has the pluralityof the multiple dotted grooves 104 aligned with the contact leads 102.The multiple dotted grooves 104 act as a solder barrier during thereflow process. This assures proper wetting of the contacts of thepassive component 704 and reliable connection to the lead tab 902.

Referring now to FIG. 10, therein is shown a plan view of an etchedleadframe flipchip package system 1000 in an alternative embodiment ofthe present invention. The plan view of the etched leadframe flipchippackage system 1000 includes a half etched die paddle 1002, thermalcontacts 1004 and half etched tie bars 1006. The half etched die paddle1002 is selectively patterned with the thermal contacts 1004, ingeometric shapes, such as circles, that align with thermal pads on theflipchip die (not shown). The etching of the half etched die paddle 1002and the half etched tie bars 1006 is performed by a chemical deflashingof the top surface of the leadframe paddle (not shown). The plan view ofthe etched leadframe flipchip package system 1000 also includes asection line 11-11 that shows the section view of FIG. 11.

Referring now to FIG. 11, therein is shown a cross-sectional view of theetched leadframe flipchip package system 1000 along the line 11-11 ofFIG. 10. The cross-sectional view depicts the half etched die paddle1002, having the thermal contacts 1004 extending in the range between 25μm and 60 μm above the etched level of the half etched die paddle 1002.The cross-sectional view depicts a limited number of the thermalcontacts 1004, but it is understood that this is for example only andthe actual number of the thermal contacts 1004 may vary.

Referring now to FIG. 12, therein is shown a cross-sectional view of anintegrated circuit package system 1200, including the etched leadframeflipchip package system 1000 of FIG. 10. The cross-sectional viewdepicts an integrated circuit 1202 and signal connections 1204, such assolder balls, solder columns or stud bumps. The cross-sectional viewalso depicts thermal interconnects 1206, such as solder balls, soldercolumns or stud bumps, attached between the integrated circuit 1202 andthe thermal contacts 1004 of the etched leadframe flipchip packagesystem 1000. This configuration allows containment of the solder ballspread in the reflow process and it allows an unobstructed flow area forthe molding compound 208 in the encapsulation process.

Referring now to FIG. 13, therein is shown a plan view of an etchedleadframe flipchip package system 1300 in yet another alternativeembodiment of the present invention. The plan view includes an etcheddie paddle 1302, having thermal interface bars 1304 and etched tie bars1306. The etched die paddle 1302 and the etched tie bars 1306 are bothsubject to a chemical deflashing of the top surface, reducing theirthickness by a range of 25 μm and 60 μm. The thermal interface bars 1304remain their original thickness.

Referring now to FIG. 14, therein is shown a cross-sectional view of theetched leadframe flipchip package system 1300 along the line 14-14 ofFIG. 13. The cross-sectional view depicts the relative height of theetched die paddle 1302 and the thermal interface bars 1304. The chemicaldeflashing of the etched die paddle 1302 may reduce the thickness in therange of 25 μm and 60 μm. The thermal interface bars 1304 are shown asrectangles, but they may be of any shape that will align with thethermal interface of a flipchip integrated circuit (not shown) orintegrated power device (not shown).

Referring now to FIG. 15, therein is shown a plan view of an etchedleadframe flipchip package system 1500 in yet another alternativeembodiment of the present invention. The plan view includes a chemicallyetched die paddle 1502, thermal pedestals 1504 and chemically etched tiebars 1506. The chemically etched die paddle 1502 and the chemicallyetched tie bars 1506 are both subject to a chemical deflashing of thetop surface, reducing their thickness by a range of 25 μm and 60 μm. Thethermal pedestals 1504 remain their original thickness.

Referring now to FIG. 16, therein is shown a cross-sectional view of theetched leadframe flipchip package system 1500 along the line 16-16 ofFIG. 15. The cross-sectional view depicts the relative height of thechemically etched die paddle 1502 and the thermal pedestals 1504. Thechemical deflashing of the chemically etched die paddle 1502 may reducethe thickness in the range of 25 μm and 60 μm. The thermal pedestals1504 are shown as squares, but they may be of any shape that will alignwith the thermal interface of a flipchip integrated circuit (not shown)or integrated power device (not shown).

Referring now to FIG. 17, therein is shown a flow chart of an etchedleadframe flipchip package system 1700 for manufacture of the etchedleadframe flipchip package system 100 in an embodiment of the presentinvention. The system 1700 includes forming a leadframe comprisesforming contact leads and etching the plurality of the multiple dottedgrooves on the contact leads in a block 1702; and providing attaching aflipchip integrated circuit, having solder interconnects, to theleadframe, the solder interconnects on the contact leads between themultiple dotted grooves in a block 1704.

In greater detail, an etched leadframe flipchip package system in anembodiment of the present invention, is performed as follows:

-   -   (1) 1. Forming a leadframe further comprises, forming a die        paddle, forming contact leads around the die paddle, wherein the        contact leads and the die paddle are half etched, forming tie        bars between the die paddle and the contact leads and etching        the plurality of the multiple dotted grooves on the contact        leads and the die paddle. (FIG. 1)    -   (2) 2. Attaching a flipchip integrated circuit to the contact        leads further comprises attaching a solder interconnect between        the flipchip integrated circuit and the leadframe. (FIG. 2)    -   (3) 3. Encasing in a molding compound, the leadframe and the        flipchip integrated circuit further comprises forming a flipchip        quad leadless package (FC-QLP). (FIG. 2)

It has been discovered that the present invention thus has numerousaspects.

It has been discovered that utilization of the etched leadframe flipchippackage system provides a reliable package assembly that is easy tomanufacture.

An aspect is that the present invention provides uniform solderconnection by preventing solder ball collapse during the reflow process.The chemical deflashing of the top surface of the die paddle and the tiebars allows molding compound to readily flow around the leadframe andthe integrated circuit.

Another aspect is the etched leadframe flipchip package system can beused to package active integrated circuits, integrated power devices andcan include passive components within the package for either type ofchip. This results in a very efficient and vertically thin package.

Yet another important aspect of the present invention is that itvaluably supports and services the historical trend of reducing costs,simplifying systems, and increasing performance.

These and other valuable aspects of the present invention consequentlyfurther the state of the technology to at least the next level.

Thus, it has been discovered that the etched leadframe flipchip packagesystem method and apparatus of the present invention furnish importantand heretofore unknown and unavailable solutions, capabilities, andfunctional aspects for producing a flipchip quad leadless package. Theresulting processes and configurations are straightforward,cost-effective, uncomplicated, highly versatile and effective, can beimplemented by adapting known technologies, and are thus readily suitedfor efficiently and economically manufacturing FC-QLP devices fullycompatible with conventional manufacturing processes and technologies.The resulting processes and configurations are straightforward,cost-effective, uncomplicated, highly versatile, accurate, sensitive,and effective, and can be implemented by adapting known components forready, efficient, and economical manufacturing, application, andutilization.

While the invention has been described in conjunction with a specificbest mode, it is to be understood that many alternatives, modifications,and variations will be apparent to those skilled in the art in light ofthe aforegoing description. Accordingly, it is intended to embrace allsuch alternatives, modifications, and variations which fall within thescope of the included claims. All matters hithertofore set forth hereinor shown in the accompanying drawings are to be interpreted in anillustrative and non-limiting sense.

1. An etched leadframe flipchip package system comprising: forming aleadframe comprises: forming contact leads, and etching a plurality ofmultiple dotted grooves on the contact leads; and attaching a flipchipintegrated circuit having solder interconnects on the contact leadsbetween each of the plurality of the multiple dotted grooves.
 2. Thesystem as claimed in claim 1 further comprising forming a die paddlehaving a geometric shape of the multiple dotted grooves on the diepaddle.
 3. The system as claimed in claim 1 further comprising forming asolder isolation barrier with the multiple dotted grooves.
 4. The systemas claimed in claim 1 further comprising attaching a passive componentto the contact leads, wherein the passive component is bordered by themultiple dotted grooves.
 5. The system as claimed in claim 1 furthercomprising forming a heat sink for serving as a half etched die paddle,wherein the die paddle is half etched allowing a path for a moldingcompound.
 6. An etched leadframe flipchip package system comprising:forming a leadframe comprises: half etching a die paddle, half etchingcontact leads around the die paddle, forming tie bars to the die paddle,and etching a plurality of multiple dotted grooves on the contact leadsand the die paddle; attaching a flipchip integrated circuit havingsolder interconnects on the contact leads; and encasing the leadframeand the flipchip integrated circuit.
 7. The system as claimed in claim 6further comprising forming multiple dotted grooves in a configuration onthe die paddle for preventing seepage of the solder interconnects. 8.The system as claimed in claim 6 further comprising forming a solderisolation barrier with the plurality of the multiple dotted grooves toprevent the solder interconnects from collapsing.
 9. The system asclaimed in claim 6 further comprising attaching a passive component tothe contact leads, wherein the passive component is bordered by theplurality of the multiple dotted grooves.
 10. The system as claimed inclaim 6 further comprising forming a thermal contact on the die paddleby etching of the top surface, where the etching forms a path for themolding compound.
 11. An etched leadframe flipchip package systemcomprising: a leadframe further comprises: contact leads, and aplurality of multiple dotted grooves etched on the contact leads; and aflipchip integrated circuit having solder interconnects on the contactleads between the plurality of the multiple dotted grooves.
 12. Thesystem as claimed in claim 11 wherein the plurality of the multipledotted grooves on the die paddle form a geometric shape.
 13. The systemas claimed in claim 11 further comprising a solder isolation barrier,wherein the solder isolation barrier comprises the plurality of themultiple dotted grooves on the die paddle.
 14. The system as claimed inclaim 111 further comprising a passive component attached to the contactleads, wherein the passive component is bordered by the plurality of themultiple dotted grooves.
 15. The system as claimed in claim 11 furthercomprising a heat sink formed by etching the top surface of the diepaddle, the heat sink comprising solder interconnects between the diepaddle and the flipchip integrated circuit.
 16. The system as claimed inclaim 11 further comprising: a die paddle and the contact leads halfetched; tie bars formed to the die paddle; and a flipchip quad leadlesspackage having the flipchip integrated circuit and the leadframe encasedin a molding compound.
 17. The system as claimed in claim 16 furthercomprising a geometric shape defined by each of the plurality of themultiple dotted grooves on the die paddle.
 18. The system as claimed inclaim 16 further comprising a solder isolation barrier, wherein thesolder isolation barrier comprises the plurality of the multiple dottedgrooves to prevent the solder interconnects from collapsing.
 19. Thesystem as claimed in claim 16 further comprising a passive componentattached to the contact leads, wherein the passive component is borderedby the plurality of the multiple dotted grooves.
 20. The system asclaimed in claim 16 further comprising a heat sink formed by etching thetop surface of the die paddle, wherein the heat sink comprises solderinterconnects between the die paddle and the flipchip integrated circuitthat allow a flow of molding compound.